发明名称 DIRECT/LAMINATE HYBRID ENCAPSULATION AND METHOD OF HYBRID ENCAPSULATION
摘要 An encapsulated device achieves good water vapor transmission rates while reducing the amount of time needed in an inert environment, and thereby reducing the size of the deposition tool used to encapsulate the device. The encapsulated device includes a first barrier layer deposited directly on the device, and a first adhesive and first laminate on the first barrier layer. The laminate comprises a polymeric substrate and a second barrier layer on the substrate. The first barrier layer has a water vapor transmission rate suitable to allow lamination of the laminate on the first barrier layer in a non-inert environment. A method of making an encapsulated device comprises depositing a first barrier layer on the device in an inert environment, applying an adhesive on the first barrier layer in a non-inert environment, and applying a first laminate on the first adhesive in the non-inert environment.
申请公布号 US2015348803(A1) 申请公布日期 2015.12.03
申请号 US201514723366 申请日期 2015.05.27
申请人 SAMSUNG SDI CO., LTD. 发明人 Moro Lorenza;Boesch Damien;Zeng Xianghui
分类号 H01L21/56;H01L23/31;H01L23/29 主分类号 H01L21/56
代理机构 代理人
主权项 1. An encapsulated device, comprising: a first barrier layer comprising a first barrier material deposited directly on the device; a first adhesive on the first barrier layer; and a first laminate on the adhesive, the first laminate comprising a polymeric substrate and a second barrier layer on the polymeric substrate, the second barrier layer comprising a second barrier material, the first barrier layer having a water vapor transmission rate suitable to allow application of the adhesive and lamination of the first laminate on the first barrier layer in a non-inert environment.
地址 Yongin-Si KR