发明名称 |
METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM |
摘要 |
In accordance with one embodiment of the present disclosure, a method for depositing metal on a reactive metal film on a workpiece includes electrochemically depositing a metallization layer on a seed layer formed on a workpiece using a plating electrolyte having at least one plating metal ion, a pH range of about 1 to about 6, and applying a cathodic potential in the range of about -0.5 V to about -4 V. The workpiece includes a barrier layer disposed between the seed layer and a dielectric surface of the workpiece, the barrier layer including a first metal having a standard electrode potential more negative than 0 V and the seed layer including a second metal having a standard electrode potential more positive than 0 V. |
申请公布号 |
EP2949785(A1) |
申请公布日期 |
2015.12.02 |
申请号 |
EP20150169683 |
申请日期 |
2015.05.28 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
SHAVIV, ROEY;EMESH, ISMAIL T.;ARGYRIS, DIMITRIOS;AKSU, SERDAR |
分类号 |
C25D7/12;C25D3/02;C25D3/38;H01L21/768 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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