PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME AND PACKAGE ON PACKAAGE HAVING THE THEREOF

摘要

The present invention relates to a printed circuit board, a method for manufacturing the printed circuit board, and a stacked package including the same. According to one embodiment of the present invention, the printed circuit board includes one side connected to one side of a substrate on which a first electronic component is mounted, and at least one insulation layer. A cavity receiving at least a part of the first electronic component is formed on the insulation layer and an inner side of the cavity is made of an insulating material.