发明名称 RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
摘要 The present invention relates to a resin molding apparatus which stably supplies a granular resin to a cavity. On a resin material accommodating frame (1), a through-hole (2), a circumference unit (3) formed on a circumference of the through-hole (2), a suction groove (4) arranged on a lower surface of the circumference unit (3), a protrusion unit (5) formed on the lower surface side of the circumference unit (3), and an elevation member (6) elevated along the inside of the circumference unit (3) are arranged. A resin material supply device (1A) is formed by integrating the resin material accommodating frame (1) with a release film (9) adsorbed to the lower side of the circumference unit (3). The elevation member (6) is dropped by the weight thereof, comes in contact with the protrusion unit (5), and stops in the resin material supply device (1A). A resin material (10) is prevented from moving from a resin material accommodating unit (2A) toward the outside as a lower side of the elevation member (6) comes in close contact with the release film (9). Therefore, the resin material (10) can be prevented from entering a space between the lower side of the resin material accommodating frame (1) and an upper side of the release film (9).
申请公布号 KR20150135129(A) 申请公布日期 2015.12.02
申请号 KR20150070904 申请日期 2015.05.21
申请人 TOWA CORPORATION 发明人 MIZUMA KEITA
分类号 B29C39/18;B29C39/22;B29C39/24 主分类号 B29C39/18
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