| 发明名称 |
UNDERFILL COMPOSITION AND PACKAGING PROCESS USING THE SAME |
| 摘要 |
The present invention provides a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition. |
| 申请公布号 |
EP2948506(A1) |
申请公布日期 |
2015.12.02 |
| 申请号 |
EP20130872817 |
申请日期 |
2013.01.23 |
| 申请人 |
HENKEL IP & HOLDING GMBH;ABLESTIK (SHANGHAI) LIMITED |
发明人 |
HU, XIAOLONG;WYATT, DEREK;ENGLAND, JIONG;GLEESON, PAUL J.;HE, RENFEI |
| 分类号 |
C08L63/00;C08G59/40;C08L33/08;C08L33/10;H01L21/56;H01L23/29 |
主分类号 |
C08L63/00 |
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