发明名称 |
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD |
摘要 |
It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition.. The outer layer is 0.021 to 0.12 µ m in thickness. |
申请公布号 |
EP2950335(A2) |
申请公布日期 |
2015.12.02 |
申请号 |
EP20150169504 |
申请日期 |
2008.07.24 |
申请人 |
NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.;NIPPON MICROMETAL CORPORATION |
发明人 |
UNO, TOMOHIRO;KIMURA, KEIICHI;TERASHIMA, SHINICHI;YAMADA, TAKASHI;NISHIBAYASHI, AKIHITO |
分类号 |
H01L21/60;H01B5/02;H01L23/49 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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