发明名称 3D MEMORY
摘要 Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.
申请公布号 EP2948983(A1) 申请公布日期 2015.12.02
申请号 EP20140743125 申请日期 2014.01.23
申请人 MICRON TECHNOLOGY, INC. 发明人 HOPKINS, JOHN;FAN, DARWIN FRANSEDA;SIMSEK-EGE, FATMA ARZUM;BRIGHTEN, JAMES;MAURI, AURELIO GIANCARLO;JAYANTI, SRIKANT
分类号 H01L27/115;H01L21/28;H01L29/423;H01L29/66;H01L29/788 主分类号 H01L27/115
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