| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which the impairment of durability of a connection member is suppressed, and a manufacturing method of the device. <P>SOLUTION: In a semiconductor device in which a chip 10 and a pedestal 30 are mechanically connected via a connection member 50, the connection member 50 is interposed between the chip 10 and the pedestal 30, and a stress relaxing member 70 is mechanically connected to at least one of whole areas of a top face 10c and a side face 10b of the chip 10. The pedestal 30 has a higher linear expansion coefficient than the connection member 50. The pedestal 30, the connection member 50, and the stress relaxing member 70 have the higher linear expansion coefficient than the chip 10. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
