摘要 |
The present invention relates to a conductive composition and, more specifically, to a conductive copper ink or paste composition for micropattern printing which can improve surface roughness and increase electrode density formed in a sintering process by comprising a metal precursor and copper (Cu) powder, thereby exhibiting excellent conductivity, adhesion with a substrate, and printing properties. |
申请人 |
DONGJIN SEMICHEM CO., LTD. |
发明人 |
LEE, SEUNG HYUK;HAN, JU KYUNG;KIM, YOUNG MO;YOO, HYUN SEOK;KIM, KYUNG EUN |