发明名称 METHOD FOR ADJUSTING DATA OF MOUNTING LOCATION OF COMPONENT MOUNTER
摘要 Disclosed is a method for adjusting mounting position data of a component mounter. The method for adjusting mounting position data of a component mounter comprises the steps of (a) to (d). In step (a), the component mounter photographs a printed circuit board with respect to a mounting position according to the mounting position data, and displays a panorama image. In step (b), the component mounter picks up a component and transfers the same to the mounting position of the printed circuit board according to the mounting position data. In step (c), the component mounter overlaps an image of the component with the panorama image and displays the overlapped image. In step (d), the component mounter sets final mounting position data of the component according to the control of a user.
申请公布号 KR20150134700(A) 申请公布日期 2015.12.02
申请号 KR20140061795 申请日期 2014.05.22
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 CHA, SUNG SOON
分类号 H05K13/04;H05K13/00 主分类号 H05K13/04
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