| 摘要 |
The present invention discloses a method for manufacturing a circuit board. The present invention includes the following steps: forming a carrier film on one side of a first metal layer and a second metal layer, thinner than the first metal layer, on the other side of the first metal layer; forming an etching resist pattern on the second metal layer and a first circuit layer by an etching process; forming a first laminate on an upper side of the first circuit layer to cover the first circuit layer; and forming a third metal layer on an upper side of the first laminate to cover the first laminate and to face the first metal layer. |
