发明名称 導電性接合材とそれを用いた接合体、及びその接合体の製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a conductive bonding material which decreases the deterioration of reflectance, an assembly using the same, and a method for manufacturing the assembly. <P>SOLUTION: The conductive bonding material has a first bonding material 4 and a second bonding material 5 provided on the first bonding material 4, wherein the first bonding material 4 contains first particles 9 and a first binder 10, the second bonding material 5 contains second particles 11 and a second binder 12, and the second particle 11 has relatively higher reflectance than that of a compound that the first particle 9 generates by a chemical reaction. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5827461(B2) 申请公布日期 2015.12.02
申请号 JP20100211408 申请日期 2010.09.21
申请人 株式会社東芝 发明人 小松 出
分类号 C09J7/00;B32B7/02;B32B7/04;C09J5/04;C09J9/02;C09J11/04;C09J201/00;H01B1/22;H01R11/01 主分类号 C09J7/00
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