| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide: a method for joining substrates by which even different type substrates can be joined with a simple constitution within a temperature range including room temperatures and without needing ultrahigh vacuum and high level flatness; and an electronic component package.SOLUTION: A method for joining substrates includes: a first step of forming an adhesion layer 12 and an Au thin film 13 on a first substrate; a second step of forming a pattern mask 15; a third step of forming an Au alloy 16 using electrolytic plating through the pattern mask; a fourth step of removing the pattern mask; a fifth step of removing metal compositions other than Au left on the first substrate to form nanoporous Au 14 from the Au alloy; a sixth step of activating the surface of the first substrate by surface treatment; a seventh step of forming an Au thin film 21 or nanoporous Au on a second substrate 20 to be activated; and an eighth step of causing the first substrate and the second substrate to face each other and pressurizing the substrates within a temperature range including room temperatures while the nanoporous Au 14 on the first substrate is brought into contact with the surface of the Au thin film 21 or the nanoporous Au on the second substrate.</p> |
