发明名称 基板の溝加工ツール及び溝加工装置
摘要 <p>The invention provides a groove processing tool and a groove processing apparatus for a substrate, which can be used for groove processing relatively accurately without adjustment of processing position even under the condition of replacement of tools. The groove processing tool (2) is retained on a retaining tool (17) and the groove processing tool and the retaining tool move oppositely on the substrate as the processing target together. The tool for forming a groove on the substrate comprises a tool body (36) and a blade tip part (37). The tool body (36) comprises an engaging surface (36a) pressed against the retaining tool (17) and is retained to the retaining tool (17). The blade tip part (37) is formed at the front end of the tool body (36), a reference surface (37a) extending from the engaging surface (36a) continuously and being coplanar with the engaging surface (36a) and has an established width from the reference surface (37a).</p>
申请公布号 JP5826665(B2) 申请公布日期 2015.12.02
申请号 JP20120032895 申请日期 2012.02.17
申请人 三星ダイヤモンド工業株式会社 发明人 曽山 正信
分类号 B23D13/00;B23D1/18;B23D7/06 主分类号 B23D13/00
代理机构 代理人
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