| 摘要 |
An electronic device comprises: an outer case generally forming an internal volume; a circuit board positioned within the internal volume and having a first surface and a second surface; one or more active components mounted on the first surface of the circuit board; and a thermal management system cooling the active components. The thermal management system comprises: a first heat spreader coming in thermal contact with the active component; a second heat spreader coming in thermal contact with the second surface of the circuit board; thermal carriers coupled to the first and second heat spreaders to remove thermal energy therefrom; and a heat exchanger coupled to the thermal carriers to receive thermal energy therefrom and dissipate the thermal energy. According to the thermal management system, one thermal carrier passes between the first heat spreader and the heat exchanger, and the other thermal carrier passes between the second heat spreader and the heat exchanger. |
