发明名称 接合方法及び接合体
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a joined body connected with good adhesion using a pair of substrates one of which has high surface roughness. <P>SOLUTION: The joined body 100 comprises: a first substrate 1; a second substrate 2; and a polysilsesquioxane film 3 and a polyorganosiloxane film 4 disposed between the first substrate 1 and the second substrate 2. The first substrate 1 and the second substrate 2 are connected through the two layers. After energy is given to the polysilsesquioxane film 3 and the polyorganosiloxane film 4, the first substrate 1 and the second substrate 2 are connected. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5828369(B2) 申请公布日期 2015.12.02
申请号 JP20110013754 申请日期 2011.01.26
申请人 セイコーエプソン株式会社 发明人 松尾 泰秀
分类号 B32B27/00;B32B7/10;B32B27/16;C09J5/02 主分类号 B32B27/00
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