发明名称 固体撮像素子及び固体撮像素子の製造方法、電子機器
摘要 <p>PROBLEM TO BE SOLVED: To provide a solid-state image sensor which is capable of suppressing surface defects caused by a film stress difference at an interface of each layer and is excellent in condensing characteristics.SOLUTION: The solid-state image sensor comprises: a photoelectric conversion part 12 formed in a semiconductor substrate 11; light transmission insulating layers 17 and 18; a first flattening layer 19; a color filter 20 having a step on its surface; a second flattening layer 21 made of an organic material; a stress relaxation layer 22; a microlens layer 23 made of an inorganic material; and a transparent resin layer 24. The film stresses of the microlens layer 23, the stress relaxation layer 22, and the second flattening layer 21 satisfy a relation of (the film stress of the microlens layer 23)>(the film stress of the stress relaxation layer 22)>(the film stress of the second flattening layer 21). The refractive index of the transparent resin layer 24 is smaller than that of the microlens layer 23.</p>
申请公布号 JP5825398(B2) 申请公布日期 2015.12.02
申请号 JP20140103003 申请日期 2014.05.19
申请人 ソニー株式会社 发明人 前田 兼作;松谷 弘康;守屋 雄介
分类号 H01L27/14;H01L21/318;H01L21/768;H01L23/532 主分类号 H01L27/14
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