发明名称 |
COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY THIN PLATE FOR ELECTRONIC/ELECTRIC DEVICE, ELECTROCONDUCTIVE COMPONENT AND TERMINAL FOR ELECTRONIC/ELECTRIC DEVICE |
摘要 |
A copper alloy for an electric and electronic device comprises 23 mass% to 36.5 mass% of Zn; 0.1 mass% to 0.9 mass% of Sn; 0.15 mass% to less than 1.0 mass% of Ni; 0.001 mass% to less than 0.10 mass% of Fe; 0.005 mass% to 0.1 mass% of P; and a balance including Cu and unavoidable impurities, in which 0.002‰¤Fe/Ni<0.7, 3<(Ni+Fe)/P<15, and 0.3<Sn/(Ni+Fe)<2.9, are satisfied by atomic ratio, and a fraction R{220} of the X-ray diffraction intensity from the {220} plane is 0.8 or less. |
申请公布号 |
EP2949769(A1) |
申请公布日期 |
2015.12.02 |
申请号 |
EP20130872724 |
申请日期 |
2013.06.28 |
申请人 |
MITSUBISHI MATERIALS CORPORATION;MITSUBISHI SHINDOH CO., LTD. |
发明人 |
MAKI, KAZUNARI;MORI, HIROYUKI;YAMASHITA, DAIKI |
分类号 |
C22C9/04;B21B3/00;B32B15/01;C22F1/08;H01B1/02;H01B5/02 |
主分类号 |
C22C9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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