封装基板及封装结构;PACKAGE SUBSTRATE AND PACKAGE STRUCTURE

摘要

一种封装基板及封装结构，该封装基板系包括：至少其中之二者具有厚度差的复数介电层；以及复数与各该介电层交互堆叠之线路层。本发明能有效避免基板的翘曲现象发生。; and a plurality of circuit layers, each interstacked with a respective dielectric layer, thereby preventing package warpage as encountered in prior techniques.