发明名称 | Memory card adapter | ||
摘要 | A memory card adaptor is provided which includes a housing including a bottom lid and a top lid that form the housing. The housing may be configured to receive a memory card. The memory card adaptor may include a package substrate between the bottom lid and the top lid. The package substrate may include a core having a first surface and a second surface; a first layer on the first surface, and the first layer may include a plurality of contact lands; and a second layer on the second surface, and the second layer may include a plurality of contact pads that are electrically connected with the contact lands through a plurality of via holes. The plurality of via holes may be formed such that they penetrate the core. One of the first and second layers may include a return path on at least one signal line. | ||
申请公布号 | US9202160(B2) | 申请公布日期 | 2015.12.01 |
申请号 | US201313953967 | 申请日期 | 2013.07.30 |
申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Han Seok-Jae |
分类号 | H01R24/00;G06K19/077 | 主分类号 | H01R24/00 |
代理机构 | Harness, Dickey & Pierce, PLC | 代理人 | Harness, Dickey & Pierce, PLC |
主权项 | 1. A memory card adaptor, comprising: a housing including a bottom lid and a top lid where the top lid together with the bottom lid form the housing, the housing configured to receive a memory card; and a package substrate between the bottom lid and the top lid, the package substrate being fixed to the bottom lid, the package substrate including, a core having a first surface and a second surface,a first layer on the first surface, the first layer including a plurality of contact lands,a second layer on the second surface, the second layer including a plurality of contact pads electrically connected with the plurality of contact lands through a plurality of via holes, the plurality of via holes being formed to penetrate the core, andone of the first layer and the second layer including a conduction area operating as a return path for at least one signal line, the conduction area defining at least one channel through which a wire is disposed, the wire electrically connecting one of the contact lands or contact pads with one of the via holes,wherein the package substrate is a printed circuit board. | ||
地址 | Gyeonggi-Do KR |