Manufacturing method of semiconductor device and mounting jig

摘要

A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.

主权项

1. A method of manufacturing a semiconductor device, comprising:
a process of joining a plurality of tubular contact elements onto a circuit pattern on an insulated circuit board, said process comprising the steps of: preparing a mounting jig having an insulated circuit board positioning jig for holding the insulated circuit board at a predetermined position for positioning, a tubular contact element positioning jig having a plurality of positioning holes disposed at predetermined positions to insert the plurality of tubular contact elements, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig; positioning the insulated circuit board by housing the insulated circuit board in a predetermined position on the insulated circuit board positioning jig; positioning the plurality of tubular contact elements on a circuit pattern on the insulated circuit board by laying the tubular contact element positioning jig on the insulated circuit board positioning jig and inserting the plurality of tubular contact elements into the respective positioning holes in the tubular contact element positioning jig; and placing the tubular contact element press-down jig on the tubular contact element positioning jig and heating while pressing down the plurality of tubular contact elements inserted in the plurality of positioning holes of the tubular contact element positioning jig toward the insulated circuit board, to solder the plurality of tubular contact elements positioned on the circuit pattern on the insulated circuit board to the circuit pattern on the insulated circuit board positioned in the insulated circuit board positioning jig.