发明名称 Driving system for driving first module to move with respect to housing and electronic device therewith
摘要 A driving system includes a sensor, a shape memory alloy member, a processing module and a recovery member. The sensor is installed on a housing, and the shape memory alloy member is connected to a module and the housing. The processing module is coupled to the sensor and the shape memory alloy member. The processing module supplies power to the shape memory alloy member when the processing module receives a sensing signal from the sensor, such that the shape memory alloy member is heated to deform for driving the module to move away from the housing. The recovery member is connected to the housing and for driving the module to get closer to the housing.
申请公布号 US9203939(B2) 申请公布日期 2015.12.01
申请号 US201314022234 申请日期 2013.09.10
申请人 Wistron Corporation 发明人 Fu Chuan-Cheng
分类号 H04M1/00;H04M1/02 主分类号 H04M1/00
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. A driving system for driving a first module to move relative to a housing, comprising: at least one sensor installed on the housing and for generating a first sensing signal; a first shape memory alloy (SMA) member connecting the first module and the housing; a processing module coupled to the at least one sensor and the first SMA member, the processing module supplying power to the first SMA member for heating the first SMA member when receiving the first sensing signal from the at least one sensor, such that the first SMA member deforms to drive the first module to move away from the housing to an expanding position along a first direction; and at least one first recovery member connecting the first module and the housing, the at least one first recovery member being separate from the first SMA and for driving the first module to move toward the housing so as to be in a containing position along a second direction opposite to the first direction, wherein the first direction and the second direction are straight.
地址 Hsichih, New Taipei TW