Double-sided LED and fabrication method thereof

摘要

A double-sided LED has a double-sided light emitting structure formed by electroplating or electrocasting without the need for wire bonding. The double-sided light emitting gives the chip a light-emitting angle of 150 degrees or higher. In addition, the device has good light extraction and heat dissipation characteristics.

主权项

1. A double-sided LED, comprising: a metal substrate including a first conduction region and a second conduction region; an insulating structure through the metal substrate and extending towards two sides of the metal substrate to separate the first conduction region and the second conduction region; a first light-emitting epitaxial laminated layer over a front surface of the metal substrate, comprising at least a first semiconductor layer and a second semiconductor layer from up to bottom forming a PN junction, wherein the first semiconductor layer is coupled to the first conduction region and the second semiconductor layer is coupled to the second conduction region; a second light-emitting epitaxial laminated layer over a back surface of the metal substrate, comprising at least a third semiconductor layer and a fourth semiconductor layer from bottom to up forming a PN junction, wherein the third semiconductor layer is coupled to the first conduction region and the fourth semiconductor layer is coupled to the second conduction region; a gapless junction formed between the first and second light-emitting epitaxial laminated layers and the metal substrate through the insulating structure; wherein the double-sided LED is configured such that if the first conduction region and the second conduction region are coupled to electricity, an electrical current flows substantially simultaneously into the first light-emitting epitaxial laminated layer and the second light-emitting epitaxial laminated layer, thereby realizing double-sided light emitting from the front and back surfaces of the metal substrate.