发明名称 Metal laminated structure and method for producing the metal laminated structure
摘要 There is provided a metal laminated structure comprising a first metal layer, a second metal layer and a third metal layer, the first metal layer being disposed on one surface of the second metal layer, the third metal layer being disposed on the other surface of the second metal layer, the first metal layer including at least one of tungsten and molybdenum, the second metal layer including copper, the third metal layer including at least one of tungsten and molybdenum, and a method for producing the metal laminated structure.
申请公布号 US9199433(B2) 申请公布日期 2015.12.01
申请号 US201013381703 申请日期 2010.06.08
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;A.L.M.T. CORP. 发明人 Nitta Koji;Majima Masatoshi;Inazawa Shinji;Abe Yugaku;Yokoyama Hiroshi;Suwata Osamu;Yamagata Shinichi
分类号 H01L23/373;B32B15/01;C23C28/02;C25D3/66;C25D5/10;C25D7/06;C25D7/12;H01L33/64 主分类号 H01L23/373
代理机构 Ditthavong & Steiner, P.C. 代理人 Ditthavong & Steiner, P.C.
主权项 1. A method for producing a metal laminated structure, comprising the steps of: disposing a first metal layer on one surface of a second metal layer by plating; disposing a third metal layer on the other surface of said second metal layer by plating; disposing a fourth metal layer containing copper on a side of said first metal layer opposite to that side of said first metal layer provided with said second metal layer by electroplating a copper sulfate solution; and disposing a fifth metal layer containing copper on a side of said third metal layer opposite to that side of said third metal layer provided with said second metal layer by electroplating a copper sulfate solution, wherein said plating is molten salt bath plating, wherein the metal laminated structure comprises said first metal layer, said second metal layer and said third metal layer, said first metal layer being disposed on one surface of said second metal layer, said third metal layer being disposed on the other surface of said second metal layer, said first metal layer including tungsten, said second metal layer including copper, said third metal layer including tungsten, wherein the metal laminated structure has a total thickness of not less than 20 μm and not more than 100 μm.
地址 Osaka JP