发明名称 materiais de interface térmica polimericos
摘要 In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.
申请公布号 BRPI0918187(A2) 申请公布日期 2015.12.01
申请号 BR2009PI18187 申请日期 2009.12.09
申请人 INTEL CORPORATION 发明人 ED PRACK;YI LI
分类号 C08K7/14;C08K7/16;C08K9/04;C08L63/00;C09K5/06;H05K7/20 主分类号 C08K7/14
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