| 摘要 |
The present invention relates to the use of a silicon containing compound for reducing the retention time of a polyolefin composition comprising a crosslinkable polyolefin with hydrolysable silane groups. A master batch is compounded with the polyolefin composition to form a compounding composition. The master batch comprises a matrix polymer, a Bronsted acid that is a silanol condensation catalyst and is present in the amount of 0.7 to 3.5 wt %, and a silicon containing compound with a structure according to the formula (I): (R1)x[Si(R2)y(R3)z]m wherein R1 is C6-22 alkyl, R2 is C1-10 alkoxy, R3 is —R4SiR1R2 , R4 is —(CH2)rYs(CH2)t— where Y is a difunctional heteroatomic group, x+y+z=4, and m=1. The silicon containing compound is 2 to 10 wt % of the master batch, and 0.01 to 1.5 wt % of the compounding composition. |
| 主权项 |
1. A process for reducing the retention time of a polyolefin composition comprising a crosslinkable polyolefin with hydrolysable silane groups in an extruder and/or reducing the extrusion temperature during the extrusion of the polyolefin composition, the process comprising:
adding a master batch to the polyolefin composition to form a compounding composition; and compounding the compounding composition in the extruder; wherein the master batch comprises:
a matrix polymer;a silanol condensation catalyst, wherein the silanol condensation catalyst is a Brönsted acid and is present in an amount of 0.7 to 3.5 wt % of the master batch; anda silicon containing compound in an amount of from 2 to 10 wt % of the master batch, having the structure of formula (I):
(R1)x[Si(R2)y(R3)z]m (I)wherein
R1 is a linear or branched C6- to C22-alkyl group; R2 is a linear or branched C1- to C10-alkoxy group; R3 is —R4SiR1pR2q, wherein p is 0 to 3, q is 0 to 3, with the proviso that p+q is 3; and R4 is —(CH2),Ys(CH2)t—where r and t independently are 1 to 3, s is 0 or 1 and Y is a difunctional heteroatomic group selected from —O—, —S—, —SO—, —SO2—, —NH—, —NR1— or —PR1—, where R1 and R2 are as previously defined; and x is 0 to 3, y is 1 to 4, z is 0 or 1, with the proviso that x+y+z=4; and m =1; and wherein the amount of the silicon containing compound is 0.01 to 1.5 wt % of the compounding composition. |
