发明名称 |
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package |
摘要 |
Some novel features pertain to an integrated device package (e.g., die package) that includes a package substrate, a die, an encapsulation layer and a first set of metal layers. The package substrate includes a first surface and a second surface. The die is coupled to the first surface of the package substrate. The encapsulation layer encapsulates the die. The first set of metal layers is coupled to a first exterior surface of the encapsulation layer. In some implementations, the first set of metal layers is configured to operate as a die-to-wire connector of the integrated device package. In some implementations, the integrated device package includes a second set of metal layers coupled to the second surface of the package substrate. In some implementations, the integrated device package includes a second set of metal layers coupled to a second exterior surface of the encapsulation layer. |
申请公布号 |
US9202789(B2) |
申请公布日期 |
2015.12.01 |
申请号 |
US201414254764 |
申请日期 |
2014.04.16 |
申请人 |
QUALCOMM Incorporated |
发明人 |
Kim Daeik Daniel;Velez Mario Francisco;Kim Jonghae;Nowak Matthew Michael;Zuo Chengjie;Yun Changhan Hobie;Berdy David Francis;Mikulka Robert Paul |
分类号 |
H01L23/48;H01L23/552;H01L23/31;H01L23/00;H01L23/498;H01L23/04;H01L23/538;H05K9/00 |
主分类号 |
H01L23/48 |
代理机构 |
Loza & Loza, LLP |
代理人 |
Loza & Loza, LLP |
主权项 |
1. An integrated device package comprising:
a package substrate comprising a first surface, a second surface, and an exterior side surface; a die coupled to the first surface of the package substrate; an encapsulation layer at least partially encapsulating the die, the encapsulation layer comprising a first exterior surface; and a first plurality of metal layers coupled to the first exterior surface of the encapsulation layer and the exterior side surface of the package substrate. |
地址 |
San Diego CA US |