Substrate treatment apparatus and substrate treatment method

摘要

Provided is a substrate treatment apparatus that treats a surface of a substrate while rotating the substrate. The substrate treatment apparatus includes: a physical tool unit including a physical tool configured to treat the surface of the substrate; a nozzle unit including a liquid supply nozzle configured to supply a liquid to the surface of the substrate and a gas supply nozzle configured to supply a gas to the surface of the substrate; a physical-tool-unit moving mechanism configured to move the physical tool unit along the surface of the substrate; and a nozzle-unit moving mechanism configured to move the nozzle unit along the surface of the substrate.

主权项

1. A substrate treatment apparatus that treats a surface of a substrate while rotating the substrate, the substrate treatment apparatus comprising:
a physical tool unit including a physical tool configured to treat the surface of the substrate; a nozzle unit including a liquid supply nozzle configured to supply a liquid to the surface of the substrate and a gas supply nozzle configured to supply a gas to the surface of the substrate; a physical-tool-unit moving mechanism configured to move the physical tool unit along the surface of the substrate; a nozzle-unit moving mechanism configured to move the nozzle unit along the surface of the substrate; a nozzle head casing in which the physical tool unit, the nozzle unit, the physical-tool-unit moving mechanism, and the nozzle-unit moving mechanism are mounted; a nozzle-head-casing moving unit configured to move the nozzle head device relative to the surface of the substrate; and a controller configured to control
the physical-tool-unit moving mechanism to linearly move the physical tool unit along the surface of the substrate,the nozzle-unit moving mechanism to linearly move the nozzle unit synchronized with the physical tool unit along the surface of the substrate in a direction opposite to a direction in which the physical tool unit is linearly moved thereby passing the physical tool unit and the nozzle unit in an antiparallel direction,the physical tool unit configured to treat the surface of the substrate and the nozzle unit configured to supply the liquid to the surface of the substrate at a same time under a condition that the substrate is rotating, andthe physical tool unit configured to treat a position on the surface of the substrate different from a position that the nozzle unit is supplying the liquid.