发明名称 |
Method of electroplating and depositing metal |
摘要 |
A method of electroplating and depositing metal includes: providing an insulation substrate formed with conductive through holes; forming a first conductive layer on a first surface of the insulation substrate and forming a resist layer on a first portion of the first conductive layer, leaving a second portion of the first conductive layer uncovered by the resist layer as a to-be-plated area; disposing the insulation substrate in a first electroplating solution and depositing a first metal layer on the to-be-plated area; removing the resist layer and the portion of the first conductive layer; forming a second conductive layer on a second surface of the insulation substrate; forming a mask layer on the second conductive layer; disposing the insulation substrate in a second electroplating solution and depositing a second metal layer on the first metal layer of the to-be-plated area; and removing the mask layer and the second conductive layer. |
申请公布号 |
US9204555(B2) |
申请公布日期 |
2015.12.01 |
申请号 |
US201213623480 |
申请日期 |
2012.09.20 |
申请人 |
Viking Tech Corporation |
发明人 |
Wei Shih-Long;Hsiao Shen-Li;Ho Chien-Hung |
分类号 |
C25D5/02;H05K3/10;H05K3/24;H05K3/40;H05K3/42 |
主分类号 |
C25D5/02 |
代理机构 |
Davis & Bujold, P.L.L.C. |
代理人 |
Davis & Bujold, P.L.L.C. ;Bujold Michael J. |
主权项 |
1. A method, comprising:
providing an insulation substrate formed with a plurality of conductive through holes; forming a first conductive layer on a first surface of the insulation substrate and forming a resist layer on a first portion of the first conductive layer, leaving a second portion of the first conductive layer uncovered by the resist layer as a to-be-plated area: disposing the insulation substrate in a first electroplating solution and depositing a first metal layer on the to-be-plated area, after depositing the first metal layer on the to-be-plated area, removing the resist layer and the first portion of the first conductive layer; after removing the resist layer and the first portion of the first conductive layer, forming a second conductive layer on a second surface of the insulation substrate that opposes the first surface, and forming a mask layer on the second conductive layer; disposing the insulation substrate in a second electroplating solution and depositing a second metal layer on the first metal layer of the to-be-plated area, and removing all of the mask layer and the second conductive layer. |
地址 |
Hsinchu County TW |