| 摘要 |
A substrate treatment method is executed by a substrate treatment apparatus including: a substrate maintaining rotation unit which has a spin base which can be rotated around a vertical axis line and a plurality of substrate supporting members which are installed to be rotated together with the spin base and support a substrate by touching an end edge of the substrate, and rotates the substrate around the vertical axis line while maintaining the substrate horizontally; and a treatment cup which surrounds the periphery of the substrate maintaining rotation unit, and captures a treatment solution scattered from the substrate rotated by the substrate maintaining rotation unit. The substrate treatment method includes: a substrate rotation process of rotating the substrate around the vertical axis line at a fixed solution treatment speed, by rotating the spin base; and a treatment solution supply process of supplying the treatment solution of a second flux more than a first flux to an upper plane of the substrate, as supplying the treatment solution of the first flux to a lower plane of the substrate, in parallel with the substrate rotation process. |
