于半导体材料之纤维表面均匀附着银粒子之方法;METHOD FOR UNIFORMLY FORMING SILVER PARTICLES ON SEMI-CONDUCTOR FIBER SURFACE

摘要

一种于半导体材料之纤维表面均匀附着银粒子之方法，其包括下列步骤：A)提供由半导体材料制成之纤维，纤维的直径介于50-1000nm；B)于纤维表面附着抗体；C)令银离子藉由与抗体之间的电子亲和力而聚集于纤维表面；以及D)激发该半导体材料，使银离子还原为银粒子。;本发明主要是利用抗体作为半导体材料与银离子之间的介质，让银离子可随着抗体而均匀聚集于纤维表面，而后更利用半导体材料可被激发的特性，让银离子得到电子而还原为银粒子，这些银粒子即可均匀分布在纤维表面。; B) attaching antibodies on surfaces of the fibers; C) introducing silver ions in the manner that the silver ions are attached to the surfaces of the fibers through the electron affinity between the silver ions and the antibodies; and D) exciting the semi-conductor to reduce the silver ions into silver particles. ;The present invention utilizes the antibodies as the media of the semi-conductor and the silver ions, and therefore the silver ions can attached to the fiber surfaces uniformly. Thus when the semi-conductor is excited, the silver ions can gain electrons and is reduced into silver particles that uniformly distributed on the fibers’surfaces.