| 发明名称 | Method for producing a printed circuit board | ||
| 摘要 | A method is provided for producing a printed circuit board. The method includes the step of providing an insulating substrate having a layer of aluminum material applied to the substrate. A portion of the layer of aluminum material is removed for defining a circuit trace. A layer of conductive material is applied to the layer of aluminum material. | ||
| 申请公布号 | US9204553(B2) | 申请公布日期 | 2015.12.01 |
| 申请号 | US201113582149 | 申请日期 | 2011.03.22 |
| 申请人 | Lear Corporation | 发明人 | Cubero Pitel Jose Antonio;Fores Montserrat Andreu;Torrijos Ezquerra Maria Leonor |
| 分类号 | H05K3/20;H05K3/06;H05K3/24;H05K1/09 | 主分类号 | H05K3/20 |
| 代理机构 | MacMillan, Sobanski & Todd, LLC | 代理人 | MacMillan, Sobanski & Todd, LLC |
| 主权项 | 1. A method for producing a printed circuit board comprising the steps of: providing an insulating printed circuit board substrate having a clad layer of aluminum disposed thereon; removing a portion of the clad layer of aluminum for defining circuit traces; applying a layer of solderable material onto, and in conductive relation with, at least a portion of the clad layer of aluminum using an electroless nickel plating (EN) process; and applying a layer of conductive material to the layer of solderable material. | ||
| 地址 | Southfield MI US | ||