RADIATING PIN FOR LIGHT EMITTING DIODE PACKAGE AND RADIATING MODULE COMPRISING THE SAME

摘要

The present invention relates to a heat radiation fin for a light emitting diode package which maximizes the contact surface of air and effectively radiates heat by considering the flow of air, and a heat radiation module comprising the same. For this, the heat radiation fin for a light emitting diode package includes a base which receives heat generated from a light emitting diode, and a heat radiation part which protrudes from the base, receives heat from the base and radiates heat to the outside. The outline of the cross section of the heat radiation part has a circular or polygonal shape.