| 发明名称 |
Chain extended epoxy to improve adhesion of conductive die attach film |
| 摘要 |
A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater. |
| 申请公布号 |
US9200184(B2) |
申请公布日期 |
2015.12.01 |
| 申请号 |
US201313833322 |
申请日期 |
2013.03.15 |
| 申请人 |
HENKEL IP & HOLDING GMBH |
发明人 |
Gao Junbo;Hoang Gina |
| 分类号 |
H01B1/02;H01B1/22;C09J9/02;C09J163/00;C08G59/18;C08G73/12;C09J179/08 |
主分类号 |
H01B1/02 |
| 代理机构 |
|
代理人 |
Cummings James J. |
| 主权项 |
1. A conductive adhesive composition comprising:
(i) a thermosetting resin, (ii) optionally, a film-forming resin, (iii) a conductive filler, and (iv) a chain extended epoxy prepared from a reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy, wherein the poly-functional aromatic epoxy is selected from the group consisting of: |
| 地址 |
Duesseldorf DE |
