Integration of analog transistor

摘要

An integrated circuit has two parallel digital transistors and a perpendicular analog transistor. The digital transistor gate lengths are within 10 percent of each other and the analog gate length is at least twice the digital transistor gate length. The first digital transistor and the analog transistor are implanted by a first LDD implant which includes a two sub-implant angled halo implant process with twist angles perpendicular to the first digital transistor gate edge and parallel to the analog transistor gate edge. The second digital transistor and the analog transistor are implanted by a second LDD implant which includes a two sub-implant angled halo implant process with twist angles perpendicular to the second digital transistor gate edge and parallel to the analog transistor gate edge. The first halo dose is at least 20 percent more than the second halo dose.

主权项

1. A method of forming an integrated circuit, comprising the steps:
providing a substrate comprising semiconductor material; forming a first gate of a first digital transistor having a first gate length; forming a second gate of a second digital transistor parallel to said first gate having a second gate length within 10 percent of said first gate length; forming an analog gate of an analog transistor perpendicular to said first gate and said second gate having an analog gate length at least twice said first gate length; forming a first LDD mask over said integrated circuit so as to expose said first digital transistor and said analog transistor and cover said second digital transistor; implanting first LDD dopants of a first conductivity type into said substrate adjacent to said first gate and said analog gate, while said first LDD mask is in place; implanting first halo dopants of a second, opposite, conductivity type into said substrate adjacent to said first gate and said analog gate, in two sub-implants at tilt angles of at least 15 degrees and twist angles which are substantially perpendicular to gate edges of said first digital transistor and substantially parallel to gate edges of said analog transistor, while said first LDD mask is in place; removing said first LDD mask; forming a second LDD mask over said integrated circuit so as to expose said second digital transistor and said analog transistor and cover said first digital transistor; implanting second LDD dopants of said first conductivity type into said substrate adjacent to said second gate and said analog gate, while said second LDD mask is in place; implanting second halo dopants of said second conductivity type having a dose 20 percent less than a dose of said first halo dopants into said substrate adjacent to said second gate and said analog gate, in two sub-implants at tilt angles of at least 15 degrees and twist angles which are substantially perpendicular to gate edges of said second digital transistor and substantially parallel to said gate edges of said analog transistor, while said second LDD mask is in place; and removing said second LDD mask.