| 发明名称 | Light emitting device package | ||
| 摘要 | Disclosed is a light emitting device package. The light emitting device package includes a Zener diode, a light emitting device including a light emitting diode, a body including lead frames on which the light emitting device and the Zener diode are disposed, and provided with a cavity formed on the lead frames, a first adhesive member disposed between the Zener diode and the lead frames, and a second adhesive member disposed between the light emitting device and the lead frames, and the thickness of the second adhesive member is equal to or less than the thickness of the first adhesive member. | ||
| 申请公布号 | US9202806(B2) | 申请公布日期 | 2015.12.01 |
| 申请号 | US201213428564 | 申请日期 | 2012.03.23 |
| 申请人 | LG INNOTEK CO., LTD. | 发明人 | Kim Byungmok;Jung Sujung |
| 分类号 | H01L33/00;H01L25/16;F21K99/00;F21Y101/02;H01L33/62 | 主分类号 | H01L33/00 |
| 代理机构 | Birch, Stewart, Kolasch & Birch, LLP | 代理人 | Birch, Stewart, Kolasch & Birch, LLP |
| 主权项 | 1. A light emitting device package comprising: a Zener diode; a light emitting device including a light emitting diode; a body including lead frames on which the light emitting device and the Zener diode are disposed, and provided with a cavity formed on the lead frames; a first adhesive member provided between the Zener diode and the lead frames; and a second adhesive member provided between the light emitting device and the lead frames, wherein the thickness of the second adhesive member is smaller than the thickness of the first adhesive member. | ||
| 地址 | Seoul KR | ||