| 发明名称 | Methods for producing a bond and a semiconductor module | ||
| 摘要 | A pressure chamber has first and second housing elements and first and second chamber regions. The pressure chamber is loaded with a first part, a second part, a connecting means and a sealing means. The connecting means is arranged in the first chamber region. The loaded pressure chamber is placed into a receiving region. The first housing element is pressed against the second housing element so that the pressure chamber is clamped with the aid of a working cylinder between the working cylinder and a holding frame. In the clamped state, a second gas pressure, which is higher than a first gas pressure in the first chamber region, is generated in the second chamber region. In this way, the first part, the second part and the connecting means are pressed against one another within the pressure chamber. | ||
| 申请公布号 | US9202800(B2) | 申请公布日期 | 2015.12.01 |
| 申请号 | US201313939635 | 申请日期 | 2013.07.11 |
| 申请人 | Infineon Technologies AG | 发明人 | Hong Tao |
| 分类号 | H05K3/00;H01L23/00;H01L25/07 | 主分类号 | H05K3/00 |
| 代理机构 | Murphy, Bilak & Homiller, PLLC | 代理人 | Murphy, Bilak & Homiller, PLLC |
| 主权项 | 1. A method for producing a bond, the method comprising: providing a holding frame having a receiving region; providing a pressure chamber having a first housing element and a second housing element; and for the pressure chamber: providing a first part, a second part, a connecting means and a sealing means;loading the pressure chamber with the first part, the second part and the connecting means in such a way that the connecting means is to be positioned between the first part and the second part, at least the connecting means being arranged in a first chamber region of the pressure chamber;placing the loaded pressure chamber into the receiving region;pressing the first housing element of the pressure chamber against the second housing element of the pressure chamber so that the pressure chamber placed in the receiving region is clamped with the aid of a working cylinder between the working cylinder and the holding frame; andgenerating in a second chamber region of the pressure chamber a second gas pressure, which is higher than a first gas pressure in the first chamber region, so that the first part, the second part and the connecting means are pressed against one another to form a bond. | ||
| 地址 | Neubiberg DE | ||