Embedded package in PCB build up

摘要

An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. An apparatus including a printed circuit board including a body; a computing device including a package including a microprocessor disposed within the body of the printed circuit board; and a peripheral device that provides input or output to the computing device.

主权项

1. An apparatus comprising:
a printed circuit board comprising a body of a plurality of alternating layers of conductive material and insulating material; and a package comprising a die disposed within the body of the printed circuit board, wherein the package comprises a plurality of package contact points coupled to contact points of the die and at least one of the package contact points is coupled to the one of the plurality of conductive material of the printed circuit board, wherein the package comprises a first side comprising the plurality of external package contact points and a second side opposite the first side, wherein a portion of the second side is exposed in a surface of the printed circuit board.