| 发明名称 | Semiconductor module | ||
| 摘要 | According to one embodiment, a semiconductor module has a substrate, two nonvolatile memories disposed on a first surface of the substrate, a controller to control the nonvolatile memories, disposed on the first surface of the substrate and between the two nonvolatile memories, and a plurality of terminals that are electrically connected to the two nonvolatile memories and to the controller, disposed on a second surface of the substrate. | ||
| 申请公布号 | US9202768(B2) | 申请公布日期 | 2015.12.01 |
| 申请号 | US201313789064 | 申请日期 | 2013.03.07 |
| 申请人 | Kabushiki Kaisha Toshiba | 发明人 | Aoki Hideo;Oyama Katsuhiko;Nishiyama Taku;Takubo Chiaki;Sakai Katsuya |
| 分类号 | H01L21/336;H01L23/48;H01L23/367;H01L23/42;H01L23/427;H01L23/467 | 主分类号 | H01L21/336 |
| 代理机构 | Patterson & Sheridan, LLP | 代理人 | Patterson & Sheridan, LLP |
| 主权项 | 1. A method for cooling a semiconductor module comprising a substrate, two nonvolatile memories disposed on a first surface of the substrate, and a controller to control the nonvolatile memories disposed on the first surface of the substrate and between the two nonvolatile memories, the method comprising: disposing a ball grid array that is electrically connected to the nonvolatile memories and the controller, on a second surface of the substrate, so that heat generated by the nonvolatile memories and the controller is conducted to the ball grid array, the ball grid array being positioned directly below each of the two nonvolatile memories, the ball grid array being connectable to an external device. | ||
| 地址 | Tokyo JP | ||