发明名称 |
Temperature control for GaN based materials |
摘要 |
A method of in-situ temperature measurement for a wafer treatment reactor such as a chemical vapor deposition reactor desirably includes the steps of heating the reactor until the reactor reaches a wafer treatment temperature and rotating a wafer support element within the reactor about a rotational axis. The method desirably further includes, while the wafer support element is rotating about the rotational axis, obtaining first operating temperature measurements using a first operating pyrometer that receives radiation from a first portion of the wafer support element, and obtaining first wafer temperature measurements using a wafer temperature measurement device that receives radiation from at least one wafer, the wafer temperature measurement device located at a first position. |
申请公布号 |
US9200965(B2) |
申请公布日期 |
2015.12.01 |
申请号 |
US201313801357 |
申请日期 |
2013.03.13 |
申请人 |
Veeco Instruments Inc. |
发明人 |
Gurary Alexander I.;Belousov Mikhail;Tas Guray |
分类号 |
G01J5/02;G01J5/00;G01J5/60 |
主分类号 |
G01J5/02 |
代理机构 |
Lerner, David, Littenberg, Krumholz & Mentlik, LLP |
代理人 |
Lerner, David, Littenberg, Krumholz & Mentlik, LLP |
主权项 |
1. A method of in-situ temperature measurement for a wafer treatment reactor, comprising:
(a) heating the reactor until the reactor reaches a wafer treatment temperature; (b) rotating a wafer support element within the reactor about a rotational axis; (c) while the wafer support element is rotating about the rotational axis, obtaining first operating temperature measurements using a first operating pyrometer that receives radiation from a first portion of the wafer support element; and (d) while the wafer support element is rotating about the rotational axis, obtaining first wafer temperature measurements using a wafer temperature measurement device that receives radiation from at least one wafer, the wafer temperature measurement device located at a first position, wherein the first operating pyrometer is sensitive to radiation in a first wavelength band, the wafer temperature measurement device is sensitive to radiation in a second wavelength band, and the at least one wafer is translucent or transparent to radiation in the first band and opaque to radiation in the second band. |
地址 |
Plainview NY US |