发明名称 银合金靶材及其制法与应用;SILVER ALLOY TARGET, METHOD FOR MAKING THE SAME, AND APPLICATION THEREOF
摘要 本发明提供一种银合金靶材,系实质上由银及铟或者银、铟、钯及铜所构成。其平均晶粒尺寸界于33μm到126μm之间。以该银合金靶材之总重量为基准,铟的含量大于等于0.25wt%且小于等于5wt%、钯的含量大于等于0.25wt%且小于等于3.5wt%、铜的含量大于等于0.25wt%且小于等于3wt%。透过预定比例之铟、或者铟、钯与铜的添加,并控制平均晶粒尺寸界于33μm与126μm之间,该银合金靶材可经由溅镀制得兼具有良好耐热性、抗硫化性、附着力、高反射率及高精细度的银合金薄膜。据此,该银合金靶材不仅符合实用性,亦能广泛的应用于有机发光二极体的产业与领域。; the content of palladium is greater than or equal to 0.25 wt%, and less than or equal to 3.5 wt%; the content of copper is greater than or equal to 0.25 wt%, and less than or equal to 3 wt%. By using predetermined amount of indium, or indium, palladium and copper, and the controlled average grain size ranging from 33 μm to 126 μm, a silver alloy film with good thermal resistance, anti-sulfide property, adhesion, high reflectivity and high finesse can be produced after sputtering the silver alloy target. Accordingly, the silver alloy target not only has practicality, but also meets the needs of the industry and field of organic light-emitting diode.
申请公布号 TW201544613 申请公布日期 2015.12.01
申请号 TW103118045 申请日期 2014.05.23
申请人 光洋应用材料科技股份有限公司 SOLAR APPLIED MATERIALS TECHNOLOGY CORP. 发明人 林守贤 LIN, SHOU HSIEN
分类号 C23C14/34(2006.01);C22F1/14(2006.01);H01L51/50(2006.01) 主分类号 C23C14/34(2006.01)
代理机构 代理人 桂齐恒林景郁
主权项
地址 台南市安南区工业三路1号 TW