APPARATUS FOR ATTACHING SOLDER BALL AND METHOD OF MANUFACTURING THE SAME

摘要

Provided are a solder ball attaching device, a manufacturing method thereof, and a solder ball attaching method using the same. The solder ball attaching device comprises: a housing; a porous plate arranged on a lower surface of the housing; a mask pattern having holes for providing a space which temporarily accommodates a solder ball wherein the mask pattern is arranged on a lower surface of the porous plate; and a vacuum unit for providing vacuum by the porous plate.