HOLLOW SEALING SHEET AND METHOD FOR MANUFACTURING HOLLOW PACKAGE

摘要

Provided are: a hollow sealing sheet that can produce a highly reliable hollow package; and a method for producing a hollow package. The hollow sealing sheet is for hollow-sealing an electronic component, contains resin, and has controlled resin ingress properties into the hollow section at 40-100°C inclusive. The resin fills a molding die having a slit having a width of 20 μm, and the amount of resin ingress into the slit when the resin is compressed for 10 minutes at a temperature of 150°C and a pressure of 10 kg/cm2 is preferably no greater than 3 mm.