LEAD-FREE EUTECTIC SOLDER ALLOY COMPRISING ZINC AS THE MAIN COMPONENT AND ALUMINUM AS AN ALLOYING METAL,申请号SG10201401618Y-传众专利搜索

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发明名称	LEAD-FREE EUTECTIC SOLDER ALLOY COMPRISING ZINC AS THE MAIN COMPONENT AND ALUMINUM AS AN ALLOYING METAL
摘要
申请公布号	SG10201401618Y(A)	申请公布日期	2015.11.27
申请号	SG10201401618Y	申请日期	2014.04.17
申请人	HERAEUS MATERIALS SINGAPORE PTE. LTD.	发明人	WEI CHIH PAN;JOSEPH AARON MESA BAQUIRAN;INCIONG REYNOSO
分类号		主分类号
代理机构		代理人
主权项
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