| 摘要 |
A sealing sheet, obtained by half-cutting a sealing sheet larger than a semiconductor substrate in the shape of the semiconductor substrate and forming a sealing-sheet piece, is mounted on an attachment jig and tension is applied to the sealing sheet, and the attachment jig is superposed on a first holding table to temporarily crimp the semiconductor substrate and the sealing-sheet piece. The semiconductor substrate, which has been integrated with the sealing-sheet piece gripped by the attachment jig, is then placed on a second holding table, the entire attachment jig is contained inside a pressure-reducing chamber, and the sealing-sheet piece is pressed in a reduced-pressure state to achieve final crimping of the semiconductor substrate. |
