发明名称 |
SOCKET FOR SEMICONDUCTOR CHIP TEST AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip. |
申请公布号 |
SG11201508489S(A) |
申请公布日期 |
2015.11.27 |
申请号 |
SG11201508489S |
申请日期 |
2014.02.11 |
申请人 |
SHIN, JONG CHEON;HA, DONG HO |
发明人 |
SHIN, JONG CHEON;HA, DONG HO |
分类号 |
G01R31/26;H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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