| 摘要 |
PROBLEM TO BE SOLVED: To achieve optimization of heat treatment of a substrate outer peripheral part.SOLUTION: A substrate processing apparatus according to one embodiment includes: a holding part; a rotary mechanism; a process liquid supply part; a heating mechanism. The holding part holds a substrate. The rotary mechanism rotates the holding part. The process liquid supply part supplies a process liquid to the substrate held by the holding part. The heating mechanism heats an outer periphery part of the substrate held by the holding part. The heating mechanism includes a discharge passage, a branch passage, and a heating part. The discharge passage is used to discharge a gas toward the outer periphery part of the substrate held by the holding part. The branch passage is used to discharge a gas toward an area other than the substrate held by the holding part. The heating part heats the discharge passage and the branch passage. |
