BACK SIDE DEPOSITION APPARATUS AND APPLICATIONS

摘要

The embodiments disclosed herein pertain to methods and apparatus for depositing stress compensating layers and sacrificial layers on either the front side or back side of a substrate. In various implementations, back side deposition occurs while the wafer is in a normal front side up orientation. The front/back side deposition may be performed to reduce stress introduced through deposition on the front side of the wafer. The back side deposition may also be performed to minimize back side particle-related problems that occur during post-deposition processing such as photolithography.

主权项

1. A method of depositing a film on a back side of a substrate, comprising:
providing to a deposition reactor a substrate comprising a front side and a back side, the front side of the substrate comprising an active region comprising front side deposited material; securing the substrate in the deposition reactor such that the active region on the front side of the substrate does not contact any portion of the deposition reactor; and depositing the film on the back side of the substrate without depositing film on the front side of the substrate.