| 摘要 |
Provided is a panel manufacturing method that includes a cutting step for cutting a liquid crystal panel substrate (1) along an intended cutting line (2), wherein provided is an initial crack forming step in which in a first glass substrate plate (3) and a second glass substrate plate (4), initial cracks (8, 9) are formed respectively at end parts (3a, 4a) which are located at one end (2a) of the intended cutting line (2). The cutting step is performed by carrying out, on the liquid crystal panel substrate (1) from the upper-surface side of the liquid crystal panel substrate (1), heating by radiating a laser along the intended cutting line (2) and cooling using a coolant following the heating, and in conjunction with the foregoing, causing the initial cracks (8, 9) to develop together. |
