| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board including an intersection structure of transmission lines which improves high frequency characteristics and is capable of easily implementing thinning.SOLUTION: On a multilayer circuit board 10, a first signal line 110 and a first ground conductor 150 are formed in a first conductor layer 100, and a second signal line 210 and a second ground conductor 250 are formed in a second conductor layer 200 that confronts the first conductor layer 100 with an insulator layer 300 interposed therebetween. The first signal line 110 crosses the second signal line 210 in the case of projection in a thickness direction of the multilayer circuit board 10. In an intersection of the first and second signal lines, a gap G15 between the first ground conductor 150 and the first signal line 110 is formed smaller than a gap G10 in any other portion than the intersection. In the intersection, a gap between the second ground conductor 250 and the second signal line 210 is formed smaller than a gap in any other portion than the intersection. In the intersection with the second signal line 210, the signal line 100 is formed narrower than any other portion than the intersection. |
